Thermal engineering
Thermal analysis for a sealed IP66 electronics enclosure
How CFD-based conjugate heat transfer caught a 14 °C hotspot in a sealed IP66 enclosure before prototype — saved an estimated 2 mold revisions and 7 weeks of rework.
Electronics engineering
PCB / Embedded Systems Services
We support embedded hardware decisions in the context of the full product so control boards, packaging, and system interfaces stay aligned.
What we do
Practical support for targeted engineering work
Yantrix helps define embedded system architecture, PCB-related packaging needs, controller integration requirements, and the practical mechanical-electrical interface for product and robotics programs.
What problems we solve
- Reduce mismatch between enclosure design and electronics packaging.
- Improve planning for controller, connector, and power integration.
- Keep embedded hardware decisions aligned with the full product design.
Tools we use
- embedded architecture reviews
- ESP32 and Jetson integration
- CAD packaging studies
- interface documentation workflows
Deliverables
- Embedded system architecture notes
- Packaging and board-space recommendations
- Interface and connector documentation
- Prototype integration guidance
Use cases
Industries where this service applies
We adapt the same engineering service to different product contexts depending on the load case, packaging problem, validation target, or deployment environment.
IoT devices
Relevant when the project needs focused pcb / embedded systems support.
robotics
Relevant when the project needs focused pcb / embedded systems support.
industrial control products
Relevant when the project needs focused pcb / embedded systems support.
smart devices
Relevant when the project needs focused pcb / embedded systems support.
Related work
Case studies connected to this service
These links help visitors move from service intent to real examples of engineering work.
From the blog
Articles that support this service topic
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Simulation
Thermal analysis for electronics enclosures
How CFD-based thermal analysis catches hotspots, airflow dead zones, and IP67-versus-cooling trade-offs in electronics enclosures before the first prototype ships.
FAQ
Questions teams ask before they engage
Service-specific questions are useful for both users and search visibility around intent-driven queries.
Do you design around existing electronics too?
Yes. We can work around an existing controller or electronics stack and help define the packaging, interface, and prototype integration strategy.
Can you support enclosure and embedded design together?
Yes. That coordination is one of the main reasons clients bring us into embedded hardware work early.
Start your project
Need pcb / embedded systems support?
Send the problem, your current design stage, and any existing files. We can scope the work from there.