We use Computational Fluid Dynamics (CFD) to analyze how air, heat, and fluid behavior affect product performance so thermal bottlenecks can be solved before hardware build.
What we do
YantriX evaluates airflow, thermal buildup, pressure drop, and cooling strategy using CFD workflows suited to electronics packaging, product enclosures, and thermal management problems.
Share your technical requirements, 3D CAD files, or operating specs. NDA support is available where required before confidential file exchange.
We adapt the same engineering service to different product contexts depending on the load case, packaging problem, validation target, or deployment environment.
Compact electronics packaging, connector breakouts, thermal dissipation, and waterproof gasket architectures.
Tailored engineering, mechanical design, and rapid prototyping solutions designed specifically for industrial electronics applications.
Tailored engineering, mechanical design, and rapid prototyping solutions designed specifically for robotics applications.
Tailored engineering, mechanical design, and rapid prototyping solutions designed specifically for consumer electronics applications.
See how this engineering capability applies across real project scopes, analysis goals, and physical prototype iterations.
Thermal engineering
How CFD-based conjugate heat transfer caught a 14 °C hotspot in a sealed IP66 enclosure before prototype — saved an estimated 2 mold revisions and 7 weeks of rework.
Explore practical engineering guides related to design, manufacturing, simulation, and product development.
Simulation
How CFD thermal analysis with Conjugate Heat Transfer (CHT) catches hotspots, optimizes heatsink fins, and balances IP67 sealing with heat dissipation in electronics enclosures.
Simulation
A 2026 guide to digital twins in Indian manufacturing — what they actually are, where they pay back, what they cost, and the integration stack that makes them work versus the vapor that doesn't.
Simulation
Learn how mechanical engineers evaluate FEA stress contours, identify artificial singularities at sharp re-entrant corners, verify mesh convergence, and determine realistic Safety Factors.
Common questions teams ask before starting a project.
No. We also handle focused cooling and enclosure airflow studies when the goal is to answer a specific engineering question quickly.
Yes. That is one of the main benefits. It helps narrow the design direction before thermal validation consumes build time and budget.
Send us your CAD model and load constraints. We'll set up FEA / CFD simulations and deliver actionable engineering reports.