COMPUTATIONAL FLUID DYNAMICS

CFD, Thermal & Fluid-Flow Simulation for Product Development

Understand airflow, heat transfer, pressure behaviour and cooling performance before hardware is built. YantriX combines CFD with CAD redesign to convert simulation results into practical product improvements.

Discuss Your CFD RequirementView Thermal CFD Case Study
  • ANSYS Fluent
  • SolidWorks Flow Simulation
  • Thermal management
  • Flow and pressure
  • CAD-to-validation

Engineering simulation for real hardware

CAD → CFD → Engineering decision → CAD redesign → Prototype / iteration

Simulation results are interpreted against the defined assumptions and used to guide practical mechanical design changes.

Simulation scope

CFD Capabilities

Thermal and flow studies are scoped around the product geometry, operating conditions, and performance question.

01

Thermal management

  • Electronics and enclosure cooling
  • Hotspot identification
  • Heat-sink and fin studies
  • Natural convection
  • Forced-air cooling where supported

02

Heat transfer

  • Conduction and convection
  • Conjugate heat transfer
  • Radiation where supported
  • Temperature-field evaluation

03

Flow

  • Internal airflow
  • Fluid-flow distribution
  • Velocity fields
  • Pressure behaviour and pressure drop

04

Design iteration

  • Cooling paths and component placement
  • Vent, duct, and channel geometry
  • Fin spacing
  • Product packaging changes
Engineering evidence

Thermal CFD case study from defined studies

These engineering studies use the project assumptions and simulation results recorded for each case. Numerical values below are identified as simulation results or inputs.

CFD thermal analysis of sealed electronics enclosure showing heat distribution
Conceptual 3D thermal illustration — heat dissipation and fin architecture for a sealed IoT gateway enclosure

ENGINEERING STUDY · Simulation · CFD Thermal & Heat Dissipation

Conjugate Heat Transfer & Thermal Analysis for Sealed Electronics Enclosure

CFD simulation study analyzing conjugate heat transfer (CHT), hotspot dissipation, and external heat sink fin geometry for a sealed electronics enclosure operating in 45°C ambient air.

Problem

  • The study examined a sealed outdoor compute enclosure with a modeled 35 W total heat load at 45°C ambient, where cooling depends on internal air circulation, conduction through chassis walls, and external natural convection. It evaluated how internal thermal paths and fin spacing affect predicted steady-state temperatures.

Model

  • Imported CAD geometry into ANSYS Fluent, simplifying non-thermal details while preserving internal component volumes.
  • Specified volumetric heat generation rates for SoC (22W), power circuitry (8W), and radio module (5W).
  • Applied conjugate solid-fluid interface boundary conditions with coupled heat transfer equations.
  • Evaluated external fin spacing from 6 mm to 16 mm to determine the point where boundary-layer interference limits vertical buoyancy flow.

Engineering output

  • The simulation predicted elevated SoC junction temperatures when heat transfer relied on internal air conduction alone
  • The simulation indicated lower peak junction temperatures with a thermal block coupling the SoC to the top casing
  • The simulation identified 12 mm fin pitch as the best tested option for natural convective airflow in 45°C still air
  • The simulation predicted external casing temperatures below 55°C under the defined 45°C ambient operating condition; formal touch-temperature compliance verification was outside the scope of this study

Deliverables

  • Comprehensive CFD simulation technical report with temperature and velocity vector plots
  • Thermal resistance network diagram and heat path breakdown
  • Optimized heat sink fin CAD solid model
  • Thermal interface material (TIM) thickness and conductivity specifications
  • Hotspot ReductionCFD Thermal Simulation Study
  • 35 WTotal Heat Load (Simulation Input)
  • 45 °CAmbient Environment (Simulation Input)
  • Sealed EnclosureOutdoor Electronics Thermal Design
Read the full case study
CFD built around the physical system

A clear path from operating conditions to CAD iteration.

Useful CFD depends on the product geometry, operating assumptions, appropriate physical models, mesh quality, convergence, and engineering interpretation.

  1. 01

    Engineering question

    Define whether the study needs to predict temperature, airflow, pressure, flow distribution, or cooling performance.

  2. 02

    Geometry and fluid domain

    Prepare the product CAD and extract the relevant fluid region.

  3. 03

    Materials and fluid properties

    Set solid and fluid properties for the defined operating conditions.

  4. 04

    Boundary conditions

    Define inlet and outlet conditions, pressure, heat loads, ambient temperature, and component heat generation.

  5. 05

    Physics model

    Select heat-transfer, convection, and turbulence models that fit the engineering question.

  6. 06

    Mesh strategy

    Refine areas with strong velocity or temperature gradients, narrow flow paths, and thermal interfaces.

  7. 07

    Convergence and conservation

    Review numerical convergence and physical balances, such as mass and thermal-energy balance, where appropriate.

  8. 08

    Engineering interpretation

    Turn temperature, pressure, and velocity fields into design decisions.

  9. 09

    CAD iteration

    Revise fins, vents, ducts, channels, component locations, or enclosure geometry and rerun where required.

  10. 10

    Physical correlation

    Compare predictions with prototype measurements when project scope includes testing.

What we need to start

Share the inputs you have.

  • 3D CAD model
  • Fluid type and flow rate
  • Inlet / outlet conditions and pressure data
  • Heat generation or component power
  • Material and ambient conditions
  • Cooling architecture and target performance

When early-stage information is incomplete, we can help define reasonable study assumptions. NDA coordination is available before confidential data exchange.

Scoped deliverables

A report tied to the question.

  • Simulation setup and boundary-condition summary
  • Temperature, velocity, and pressure fields where applicable
  • Flow-path review and thermal hotspot identification
  • Engineering recommendations and CAD changes when included in scope
  • Technical simulation report

Deliverables, mesh detail, and CAD revisions are agreed for each project scope.

Applications

Engineering questions in product context.

Electronics

Enclosure cooling, thermal hotspots, and heat-transfer paths.

Industrial equipment

Internal airflow, pressure loss, and thermal management.

Product hardware

Ventilation, cooling architecture, and packaging changes.

Automation / robotics

Electronics enclosure cooling, motor-driver thermal management, and internal airflow.

Need structural analysis as well? Explore FEA & Structural Simulation →
Frequently asked questions

Before you scope a study.

A few practical details about starting a simulation engagement.

Do you only handle complex CFD studies?

No. We also handle focused cooling and enclosure airflow studies when the goal is to answer a specific engineering question quickly.

Can CFD help before prototype testing?

CFD can help compare design directions before prototype testing. Predictions depend on the geometry, material properties, boundary conditions, and physics assumptions defined for the study.

Start a technical discussion

Working through a thermal or flow problem?

Share your CAD, operating assumptions, and the engineering decision you need to make. We’ll review the scope and discuss an appropriate next step.

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